由罗杰斯公司发布
先进电子解决方案
随着电子设备尺寸不断缩小，功率不断增加，人们对更高功率密度的电力电子电路的需求也在增长。工作温度升高是提高电路功率密度的结果之一，这会增加现代电力电子电路基板的电路材料热应力。现在，人们可采用新的工艺和材料来应对这些挑战。
Soldering vs Silver Sintering
Soldering can present a number of complications that reduce a circuit’s performance, such as solder bridges and heel cracking. At higher operating temperatures, solder fatigue becomes an issue. Common die attach technologies are based on soft solders with melting points below 250°C. With the development of new generations of semiconductors (e.g. based on wide band gap materials like SiC and GaN), operating temperatures increase to more than 200°C. This will lead to a significant decrease in the solders‘ strength and reliability.
Sintering is a heat treatment process applied to a powdered material in order to give it higher strength and integrity. Silver sintering has become a promising technology for high temperature power electronics packaging as an alternative to soldering.
In the soldering process, heat is applied until a solid reaches its melting point and is then allowed to cool down and solidify to form a bond. In the silver sintering process, heat is applied to a silver paste, resulting in densification. Several actions occur simultaneously, including grain growth, pore growth, and densification, resulting in a stronger bond.
Find out what you need to know about silver sintering in the tech note: curamik® Substrates for Silver Sintering.
PCB Materials for High Power, High Temp Applications
The requirements for PCB materials capable of supporting high-density power electronics circuits are quite challenging, since they include both mechanical and electrical stability at high temperatures.
To meet these demands, curamik® ADVANTAGE provides a ceramic-materials based solution for smaller, higher power-density PCB circuits in power electronic applications. These ceramic substrates provide low dielectric loss and low-loss copper conductors that support high voltages and currents in power-grid, energy, and industrial power applications.
To improve the performance and usability of the substrate materials, all curamik ADVANTAGE products include a choice of plating materials, addition of solder stop to control solder coverage, and treatment for surface roughness. As an alternative to soldering, a state-of-the-art silver sintering process provides an attachment option to solder for critical high-temperature applications
Download the Power Magazine article for more details: Tailoring Circuit Materials for Power Electronic Applications
Watch the curamik ADVANTAGE video:
发布于 2017 年 7 月 25 日
